Sulphuric acid 96%, CMOS™ for microelectronic, J.T.Baker®

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9674-37EA 0 GBP
9674-37
Sulphuric acid 96%, CMOS™ for microelectronic, J.T.Baker®
Sulphuric acid
Formula: H₂SO₄
MW: 98.08 g/mol
Boiling Pt: ∼335 °C (1013 hPa)
Melting Pt: 3 °C
Density: 1.84 g/cm³ (20 °C)
Storage Temperature: Ambient
MDL Number: MFCD00064589
CAS Number: 7664-93-9
EINECS: 231-639-5
UN: 1830
ADR: 8,II

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Specification Test Results

Assay 95.0 - 97.0 %
Chloride (Cl) max. 0.1 ppm
Color (APHA) max. 10
Heavy Metals (as Pb) max. 200 ppb
Nitrate (NO3) max. 0.2 ppm
Particles > 0.5 µm/ml max. 150
Particles > 1.0 µm/ml max. 25
Phosphate (PO4) max. 0.3 ppm
Residue after Ignition max. 2 ppm
Trace Impurities (in ppb) 0
Aluminium (Al) max. 50
Arsenic and Antimony (as As) max. 5
Barium (Ba) max. 10
Beryllium (Be) max. 10
Bismuth (Bi) max. 20
Boron (B) max. 10
Cadmium (Cd) max. 10
Calcium (Ca) max. 50
Chromium (Cr) max. 50
Cobalt (Co) max. 10
Copper (Cu) max. 10
Gallium (Ga) max. 10
Germanium (Ge) max. 10
Gold (Au) max. 20
Iron (Fe) max. 100
Lead (Pb) max. 20
Lithium (Li) max. 10
Magnesium (Mg) max. 50
Manganese (Mn) max. 10
Mercury (Hg) max. 5
Molybdenum (Mo) max. 10
Nickel (Ni) max. 10
Niobium (Nb) max. 10
Potassium (K) max. 50
Silicon (Si) max. 50
Silver (Ag) max. 10
Sodium (Na) max. 100
Strontium (Sr) max. 10
Tantalum (Ta) max. 10
Thallium (Tl) max. 20
Tin (Sn) max. 50
Titanium (Ti) max. 10
Vanadium (V) max. 10
Zinc (Zn) max. 50
Zirconium (Zr) max. 10
For Laboratory Research or Manufacturing use.

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